• DocumentCode
    2231133
  • Title

    Analysis of soft error rate in flip-flops and scannable latches

  • Author

    Ramanarayanan, R. ; Degalahal, V. ; Vijaykrishnan, N. ; Irwin, M.J. ; Duarte, D.

  • Author_Institution
    Microsyst. Design Lab., Pennsylvania State Univ., USA
  • fYear
    2003
  • fDate
    17-20 Sept. 2003
  • Firstpage
    231
  • Lastpage
    234
  • Abstract
    Soft errors can be induced through radiation sources, with particles of low energy occurring far more frequently than particles of high energy. Therefore, smaller CMOS device are more easily affected by lower energy particles. Thus, soft errors are gaining importance as technology scales. Flip-flops, an important component of pipelined architectures, are becoming more susceptible to soft errors. This work analyzes soft error rates on a variety of flip-flops. The analysis was performed by implementing and simulating various designs in 70 nm, 1 V CMOS technology. First, we evaluate the critical charge for the susceptible nodes in each design. Further, we implement two hardening techniques and present the results. One attempts to increase the gate capacitance, the other improves the overall robustness of the circuit by replicating the master stage of the master-slave flip-flops, which leads to reduced power and area overhead.
  • Keywords
    CMOS logic circuits; error analysis; flip-flops; integrated circuit design; logic design; logic simulation; radiation hardening (electronics); 1 V; 70 nm; CMOS technology; critical charge; flip-flops; gate capacitance increase; hardening techniques; master slave flip-flops; master stage replication; pipelined architectures; radiation particle energy; radiation sources; scannable latches; soft error rate analysis; susceptible nodes; Analytical models; CMOS technology; Capacitance; Circuit simulation; Error analysis; Flip-flops; Latches; Master-slave; Performance analysis; Robustness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOC Conference, 2003. Proceedings. IEEE International [Systems-on-Chip]
  • Print_ISBN
    0-7803-8182-3
  • Type

    conf

  • DOI
    10.1109/SOC.2003.1241499
  • Filename
    1241499