• DocumentCode
    2231178
  • Title

    Bayesian sequential estimation and evaluation of process capability indices with multiple subsamples

  • Author

    Zhu, H.M. ; Yu, K.M.

  • Author_Institution
    Coll. of Bus. Adm., Hunan Univ., Changsha, China
  • fYear
    2008
  • fDate
    8-11 Dec. 2008
  • Firstpage
    2032
  • Lastpage
    2036
  • Abstract
    Process capability analysis is designed to estimate the proportion of parts that do not meet engineering requirements in a stable production process. Using process capability indices to quantify manufacturing process precision and performance is essential part of implementing any quality improvement program. In this paper, we proposed a Bayesian sequential approach to estimate and evaluate the process capability based on multiple subsamples. Its advantage is that the parameters¿ posterior distribution in the current states is considered to be their prior distribution in the next state, thus reducing the variance of the estimators through the use of the information about the past production manufacturing process. According to the parameters¿ sequential posteriors, we establish the point estimation and the one-sided confidence interval for the process capability. Finally, we give an example to illustrate application of the proposed approach.
  • Keywords
    Bayes methods; manufacturing industries; manufacturing systems; process capability analysis; quality management; Bayesian sequential estimation; Bayesian sequential evaluation; manufacturing process; process capability analysis; process capability indices; quality improvement program; Bayesian methods; Design engineering; Educational institutions; Equations; Frequency estimation; Manufacturing processes; Production; Quality assurance; State estimation; Testing; Bayesian method; Estimation; Gamma distribution; Process capability index; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management, 2008. IEEM 2008. IEEE International Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2629-4
  • Electronic_ISBN
    978-1-4244-2630-0
  • Type

    conf

  • DOI
    10.1109/IEEM.2008.4738228
  • Filename
    4738228