Title :
Design and fabrication of a micromirror using silicon bulk micromachining for out-of-plane right angle reflection
Author :
Yun-Ho Jang ; Yong-Kweon Kim
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., South Korea
Abstract :
A matter of prime importance in silicon micromirror fabrication is how to get a silicon mirror plate under structure and fabrication restrictions. Deep silicon etch, silicon-glass anodic bonding and thinning process are used in this research for a silicon mirror plate. This approach offers a flat silicon mirror plate and the thickness of a silicon plate can be thinned up to 25 /spl mu/m. The micromirror should rotate with 45 degrees for out-of-plane right angle reflection. Therefore it is difficult to use stiff materials as a torsional spring. Aluminum is a good candidate for such a large angular motion though its residual stress may also affect operation performances.
Keywords :
elemental semiconductors; etching; micromachining; micromirrors; optical fabrication; silicon; wafer bonding; Al; Si; aluminum torsional spring; deep silicon etching; out-of-plane right angle reflection; silicon bulk micromachining; silicon micromirror fabrication; silicon mirror plate; silicon-glass anodic bonding; thinning process; Aluminum; Bonding; Etching; Fabrication; Micromachining; Micromirrors; Mirrors; Reflection; Silicon; Springs;
Conference_Titel :
Optical MEMs, 2002. Conference Digest. 2002 IEEE/LEOS International Conference on
Conference_Location :
Lugano, Switzerland
Print_ISBN :
0-7803-7595-5
DOI :
10.1109/OMEMS.2002.1031452