DocumentCode
2231624
Title
Accurate modeling of substrate coupling for substrates without grounded backplates
Author
Su, Qing ; Massoud, Yehia ; Kawa, Jamil ; Chiang, Charles
Author_Institution
Synopsys, Inc, Mountain View, CA, USA
fYear
2003
fDate
17-20 Sept. 2003
Firstpage
281
Lastpage
282
Abstract
An accurate and numerically stable formulation is presented for the substrate resistive coupling using boundary element methods, for floating substrates (without grounded backplates).
Keywords
boundary-elements methods; coupled circuits; electric admittance; integrated circuit modelling; BEM; admittance matrix; boundary element methods; floating substrates; substrate coupling modeling; substrate resistive coupling; ungrounded backplate substrates; Admittance; Aging; Boundary element methods; Distributed computing; Finite difference methods; Grounding; Packaging; Permission; Very large scale integration; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
SOC Conference, 2003. Proceedings. IEEE International [Systems-on-Chip]
Print_ISBN
0-7803-8182-3
Type
conf
DOI
10.1109/SOC.2003.1241521
Filename
1241521
Link To Document