Title :
Accurate modeling of substrate coupling for substrates without grounded backplates
Author :
Su, Qing ; Massoud, Yehia ; Kawa, Jamil ; Chiang, Charles
Author_Institution :
Synopsys, Inc, Mountain View, CA, USA
Abstract :
An accurate and numerically stable formulation is presented for the substrate resistive coupling using boundary element methods, for floating substrates (without grounded backplates).
Keywords :
boundary-elements methods; coupled circuits; electric admittance; integrated circuit modelling; BEM; admittance matrix; boundary element methods; floating substrates; substrate coupling modeling; substrate resistive coupling; ungrounded backplate substrates; Admittance; Aging; Boundary element methods; Distributed computing; Finite difference methods; Grounding; Packaging; Permission; Very large scale integration; Voltage;
Conference_Titel :
SOC Conference, 2003. Proceedings. IEEE International [Systems-on-Chip]
Print_ISBN :
0-7803-8182-3
DOI :
10.1109/SOC.2003.1241521
