Title :
Cumulative Thin Film Stress From Wafer Fabrication Processes And Its Effect On Post Backgrind Wafer Shape
Author :
Kawski, James L. ; Flood, John
Author_Institution :
ADE Corporation, Newton Massachusetts
Keywords :
Equations; Fabrication; Floods; Shape measurement; Silicon; Stress measurement; Substrates; Tensile strain; Tensile stress; Transistors;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1993. ASMC 93 Proceedings. IEEE/SEMI
Conference_Location :
Boston, MA
DOI :
10.1109/ASMC.1993.682491
