Title :
A robust and reliable stress-induced self-assembly mechanism for optical devices
Author :
Yi-Ping Ho ; Mingching Wu ; Hung-Yi Lin ; Weileun Fang
Author_Institution :
Power Mech. Eng. Dept., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
Based on the MUMPs platform, this study has established an improved surface micromachining process (MUMPs-like process) to improve the reliability of the stress-induced beams. A novel rigid supporting mechanism is devised to prevent the mirror from offset. Furthermore, with this mechanism various pop-up mirrors could be accomplished. According to this MUMPs-like process, devices are fabricated to evaluate the performance of this assembly mechanism.
Keywords :
micro-optics; micromachining; micromirrors; optical fabrication; reliability; self-assembly; stress relaxation; MUMPs platform; bimorph beam; dielectric film; mirror offset prevention; optical devices; pop-up mirrors; rigid supporting mechanism; stress relaxation reduction; stress-induced beams; stress-induced self-assembly mechanism; surface micromachining process; Actuators; Assembly; Mechanical engineering; Mirrors; Optical devices; Optical films; Robustness; Self-assembly; Stress; Testing;
Conference_Titel :
Optical MEMs, 2002. Conference Digest. 2002 IEEE/LEOS International Conference on
Conference_Location :
Lugano, Switzerland
Print_ISBN :
0-7803-7595-5
DOI :
10.1109/OMEMS.2002.1031478
