Title :
Damage free dicing method for MEMS devices
Author :
Awatani, Y. ; Matsumoto, Y. ; Kato, K.
Author_Institution :
Fac. of Sci. & Technol., Keio Univ., Yokohama, Japan
Abstract :
A damage free dicing method for MEMS devices has been researched in this paper. The method is based on the bonding and detachment of a glass plate cap by using a thermoplastic adhesive. The sand blast technique was used for fabrication of the glass cap wafer, which has concavities with depth of 100 /spl mu/m. The thermoplastic adhesive (STAYSTIK373, Techno Alpha Co. Ltd.) was screen printed on the glass cap wafer. The glass cap wafer was thermocompression-bonded to silicon wafer at 210/spl deg/C and diced to individual chips. The glass cap plate was easily detached at 300/spl deg/C. This method prevented MEMS devices from suffering contamination by water or dicing dust during the dicing process. The method is easily applied to current mass-production processes, because the method is accomplished with inexpensive materials and well-established equipment. The process conditions and examples have been explained in the paper.
Keywords :
adhesives; lead bonding; micromachining; micromechanical devices; semiconductor device packaging; surface contamination; 100 micron; 210 C; 300 C; MEMS devices; STAYSTIK373 thermoplastic adhesive; Si; damage free dicing method; dicing dust contamination; glass cap wafer fabrication; glass plate cap bonding; glass plate cap detachment; mass-productive process; process conditions; sand blast technique; screen printed adhesive; silicon wafer; thermocompression bonding; water contamination; Coatings; Fabrication; Glass; Mechanical sensors; Microelectromechanical devices; Optical devices; Optical sensors; Silicon; Wafer bonding; Water pollution;
Conference_Titel :
Optical MEMs, 2002. Conference Digest. 2002 IEEE/LEOS International Conference on
Conference_Location :
Lugano, Switzerland
Print_ISBN :
0-7803-7595-5
DOI :
10.1109/OMEMS.2002.1031481
