• DocumentCode
    2232102
  • Title

    Engineering a Bandwidth-Scalable Optical Layer for a 3D Multi-core Processor with Awareness of Layout Constraints

  • Author

    Ramini, Luca ; Bertozzi, Davide ; Carloni, Luca P.

  • Author_Institution
    Eng. Dept., Univ. of Ferrara, Ferrara, Italy
  • fYear
    2012
  • fDate
    9-11 May 2012
  • Firstpage
    185
  • Lastpage
    192
  • Abstract
    The performance of future chip multi-processors will only scale with the number of integrated cores if there is a corresponding increase in memory access efficiency. The focus of this paper on a 3D-stacked wavelength-routed optical layer for high bandwidth and low latency processor-memory communication goes in this direction and complements ongoing efforts on photonically integrated bandwidth-rich DRAM devices. This target environment dictates layout constraints that make the difference in discriminating between alternative design choices of the optical layer. This paper assesses network partitioning options and bandwidth scalability techniques with deep technology and layout awareness, the main contribution lying in the characterization and precise quantification of such interaction effects between the technology platform, the layout constraints and the network-level quality metrics of a passive optical NoC.
  • Keywords
    DRAM chips; microprocessor chips; network-on-chip; three-dimensional integrated circuits; 3D multicore processor; 3D-stacked wavelength-routed optical layer; bandwidth scalability techniques; bandwidth-scalable optical layer; chip multiprocessors; layout constraint awareness; low latency processor-memory communication; memory access efficiency; network partitioning options; network-level quality metrics; passive optical NoC; photonically integrated bandwidth-rich DRAM devices; Adaptive optics; Layout; Network topology; Optical buffering; Optical fiber networks; Optical waveguides; Topology; 3D stacked logic and memory; Optical-NoC;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Networks on Chip (NoCS), 2012 Sixth IEEE/ACM International Symposium on
  • Conference_Location
    Copenhagen
  • Print_ISBN
    978-1-4673-0973-8
  • Type

    conf

  • DOI
    10.1109/NOCS.2012.29
  • Filename
    6209278