Title :
A low power open multimedia application platform for 3G wireless
Author :
Song, James ; Shepherd, Thomas ; Chau, Minh ; Huq, Ayesha ; Syed, Ikram ; Roy, Somdipta ; Thippana, Achuta ; Shi, Kaijian ; Ko, Uming
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Abstract :
This paper describes an SOC design of a complex, low power and high performance open multimedia application platform (OMAPTM) for 3G wireless. The design integrates a high performance DSP subsystem based on a low power TMS320C55x DSP and an MPU subsystem based on the ARM9 microprocessor for the optimal combination of high performance with low power consumption. This paper explains the system design and the SoC implementations of the platform.
Keywords :
3G mobile communication; digital signal processing chips; integrated circuit design; logic design; low-power electronics; multimedia communication; system-on-chip; 3G wireless; ARM9 microprocessor; MPU subsystem; OMAP; SOC; TMS320C55x DSP; high performance DSP subsystem; low power dual core architecture; open multimedia application platform; Computer architecture; Control systems; Digital audio players; Digital signal processing; Digital signal processing chips; Energy consumption; Home appliances; Instruments; Microprocessors; Videoconference;
Conference_Titel :
SOC Conference, 2003. Proceedings. IEEE International [Systems-on-Chip]
Print_ISBN :
0-7803-8182-3
DOI :
10.1109/SOC.2003.1241547
