DocumentCode
2232404
Title
New spectral linear placement and clustering approach
Author
Li, Jianmin ; Lillis, John ; Liu, Lung-Tien ; Cheng, Chung-Kuan
Author_Institution
Dept. of Comput. Sci. & Eng., California Univ., San Diego, La Jolla, CA, USA
fYear
1996
fDate
3-7 Jun, 1996
Firstpage
88
Lastpage
93
Abstract
This paper addresses the linear placement problem by using a spectral approach. It has been demonstrated that, by giving a more accurate representation of the linear placement problem, a linear objective function yields better placement quality in terms of wire length than a quadratic objective function as in the eigenvector approach [4][11][6]. On the other hand, the quadratic objective function has an advantage in that it tends to place components more sparsely than the linear objective function, resulting in a continuous solution closer to a physically feasible discrete solution. In this paper, we propose an α-order objective function to capture the strengths of both the linear and quadratic objective functions. We demonstrate that our approach yields improved spectral placements. We also present a bottom-up clustering algorithm which iteratively collapses pairs of nodes in a graph using local and global connectivity information, where the global connectivity information is derived from the clustering property of the eigenvector approach. The effect of our new spectral linear placement and clustering approach is demonstrated on benchmark circuits from MCNC
Keywords
VLSI; circuit layout CAD; eigenvalues and eigenfunctions; graph theory; integrated circuit layout; logic CAD; logic partitioning; α-order objective function; benchmark circuits; bottom-up clustering algorithm; clustering; eigenvector approach; linear objective function; quadratic objective function; spectral linear placement; Circuits; Clustering algorithms; Design automation; Ear; Iterative algorithms; Permission; Very large scale integration; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference Proceedings 1996, 33rd
Conference_Location
Las Vegas, NV
ISSN
0738-100X
Print_ISBN
0-7803-3294-6
Type
conf
DOI
10.1109/DAC.1996.545552
Filename
545552
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