Title :
A 2 Mbit Radiation Hardened Stackable Ferroelectric Memory
Author :
Hayashigawa, Don ; Kamp, David A. ; DeVilbiss, Alan D.
Author_Institution :
NxGEN Electron. Inc., San Diego, CA
Abstract :
A radiation hardened, high-performance, ferroelectric memory (FeRAM) with 2 Mb density has been designed to yield radiation characteristics useful for many satellite and space applications. The ferroelectric capacitor for each memory cell is inherently resistant to both TID and SEU effects. A design approach employing a radiation tolerant memory architecture and hardened-by-design (HBD) techniques were used for the remaining CMOS circuitry. A number of these prototype memory integrated circuits were fabricated, packaged and then electrically tested before and after irradiation. Plans have been developed, including a stacked packaging approach, for the final production version of a compact, 16 Mbit radiation hardened, nonvolatile ferroelectric memory component.
Keywords :
CMOS integrated circuits; ferroelectric capacitors; ferroelectric storage; memory architecture; radiation hardening (electronics); random-access storage; CMOS circuitry; FeRAM; SEU effects; TID effects; ferroelectric capacitor; ferroelectric memory; hardened-by-design techniques; memory integrated circuits; nonvolatile memory; radiation hardening; radiation tolerant memory architecture; stacked packaging approach; storage capacity 16 Mbit; storage capacity 2 Mbit; Capacitors; Circuit testing; Ferroelectric films; Ferroelectric materials; Integrated circuit packaging; Nonvolatile memory; Radiation hardening; Random access memory; Resistance; Satellites;
Conference_Titel :
Non-Volatile Memory Technology Symposium, 2007. NVMTS '07
Conference_Location :
Albuquerque, NM
Print_ISBN :
978-1-4244-1361-4
DOI :
10.1109/NVMT.2007.4389947