• DocumentCode
    2232611
  • Title

    Copper sulfide-based resistance change memory

  • Author

    Kim, Sung-Woo ; Nishi, Yoshio

  • Author_Institution
    Stanford Univ., Stanford
  • fYear
    2007
  • fDate
    10-13 Nov. 2007
  • Firstpage
    76
  • Lastpage
    78
  • Abstract
    Nonvolatile memories (NVMs) based on an instantaneous resistance change when an electric bias is applied are very attractive for future memory applications. Here, we report the fabrication and electrical characterization of mum-sized Cu2S NVM devices. With stoichiometric Cu2S films grown by anodic polarization, we can generate consistent and reproducible resistance switching devices. The fabricated devices exhibit large on/off ratio over 105 with low switching voltages (below 0.3 V). On-resistance (Ron) value of 150 Omega does not change as the size of the devices shrinks. On the contrary, off-resistance (Roff) depends on the device area inversely, which enables the enhancement of on/off ratio with the scaling-down of the device.
  • Keywords
    copper compounds; electric resistance; electrical resistivity; semiconductor growth; semiconductor storage; stoichiometry; ternary semiconductors; thin film devices; Cu2S; NVM device fabrication; anodic polarization; copper sulfide-based resistance change memory; electric bias; nonvolatile memories; on-off ratio; resistance switching devices; stoichiometric films; Copper; Electric resistance; Electrodes; Fabrication; Field programmable gate arrays; Low voltage; Nonvolatile memory; Polarization; Sputtering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Non-Volatile Memory Technology Symposium, 2007. NVMTS '07
  • Conference_Location
    Albuquerque, NM
  • Print_ISBN
    978-1-4244-1361-4
  • Type

    conf

  • DOI
    10.1109/NVMT.2007.4389951
  • Filename
    4389951