DocumentCode
2232611
Title
Copper sulfide-based resistance change memory
Author
Kim, Sung-Woo ; Nishi, Yoshio
Author_Institution
Stanford Univ., Stanford
fYear
2007
fDate
10-13 Nov. 2007
Firstpage
76
Lastpage
78
Abstract
Nonvolatile memories (NVMs) based on an instantaneous resistance change when an electric bias is applied are very attractive for future memory applications. Here, we report the fabrication and electrical characterization of mum-sized Cu2S NVM devices. With stoichiometric Cu2S films grown by anodic polarization, we can generate consistent and reproducible resistance switching devices. The fabricated devices exhibit large on/off ratio over 105 with low switching voltages (below 0.3 V). On-resistance (Ron) value of 150 Omega does not change as the size of the devices shrinks. On the contrary, off-resistance (Roff) depends on the device area inversely, which enables the enhancement of on/off ratio with the scaling-down of the device.
Keywords
copper compounds; electric resistance; electrical resistivity; semiconductor growth; semiconductor storage; stoichiometry; ternary semiconductors; thin film devices; Cu2S; NVM device fabrication; anodic polarization; copper sulfide-based resistance change memory; electric bias; nonvolatile memories; on-off ratio; resistance switching devices; stoichiometric films; Copper; Electric resistance; Electrodes; Fabrication; Field programmable gate arrays; Low voltage; Nonvolatile memory; Polarization; Sputtering;
fLanguage
English
Publisher
ieee
Conference_Titel
Non-Volatile Memory Technology Symposium, 2007. NVMTS '07
Conference_Location
Albuquerque, NM
Print_ISBN
978-1-4244-1361-4
Type
conf
DOI
10.1109/NVMT.2007.4389951
Filename
4389951
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