• DocumentCode
    2233343
  • Title

    Impedance method for calculation of thermoelastic interaction of surface acoustic waves in solids

  • Author

    Vyun, V.A. ; Yakovkin, I.B.

  • Author_Institution
    Inst. of Semicond. Phys., Acad. of Sci., Novosibirsk
  • fYear
    1993
  • fDate
    31 Oct-3 Nov 1993
  • Firstpage
    863
  • Abstract
    A thermal impedance has been introduced for the solution of the problem of the thermoelastic interaction of surface acoustic waves (SAW) in solids. The analytic thermal impedance is obtained for isotropic solids from the weak thermoelastic coupling approximation. The value of thermal impedance obtained depends only on three parameters: the isothermal SAW velocity, the velocity for the case without dissipation of heat from the solid surface, and a thermal impedance without acoustic waves. The extended approach allows us to investigate and analyze the effect of different surface layers and continuous materials on the thermoelastic attenuation and velocity dispersion of the SAW. For example, an ideal heat conductive layer reduces the thermoelastic SAW attenuation to zero. By analogy with excitation of the SAW by means of a high frequency periodic electric field the problem of the excitation of the SAW by means of a thermal high frequency periodic perturbation (for example by means of a laser) may easily be solved with the help of the surface thermal impedance
  • Keywords
    surface acoustic waves; thermoelasticity; heat conductive layer; isothermal SAW velocity; solids; surface acoustic waves; surface layers; thermal impedance; thermoelastic attenuation; thermoelastic interaction; Acoustic waves; Conducting materials; Frequency; Impedance measurement; Isothermal processes; Laser excitation; Solids; Surface acoustic waves; Surface impedance; Thermoelasticity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1993. Proceedings., IEEE 1993
  • Conference_Location
    Baltimore, MD
  • Print_ISBN
    0-7803-2012-3
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1993.339668
  • Filename
    339668