DocumentCode :
22334
Title :
4 A x 10 Gbit/s full-duplex optical link with compact optical sub-assemblies and thin GI 50/125 plastic optical fibre ribbon
Author :
Schlepple, N. ; Nishigaki, Masakatsu ; Uemura, Hitoshi ; Furuyama, H. ; Sugizaki, Yoshiaki ; Shibata, Hajime ; Koike, Yasuharu
Author_Institution :
Semicond. & Storage Products Co., Toshiba Corp., Yokohama, Japan
Volume :
49
Issue :
13
fYear :
2013
fDate :
June 20 2013
Firstpage :
835
Lastpage :
836
Abstract :
A full-duplex data link at 10 Gbit/s per channel (two upstream and two downstream) between two compact bidirectional optical sub-assemblies is presented. Each sub-assembly is based on the authors´ optoelectronic ferrule and carries both laser diodes and photodiodes while maintaining a compact form factor of less than 20 mm3. The authors use plastic optical fibres with 50 μm graded-index cores and thin 125 μm claddings bundled in a four-channel ribbon but split the ribbon in order to reach both laser diodes and photodiodes within the optoelectronic ferrule, hence directly butt-coupling each channel with its own optical fibre. This method keeps both assembly form factor and complexity at a minimum and performance high. Eventually error-free signal transmission at 10 Gbit/s per channel over 5 m with 0.67 unit intervals eye opening is confirmed.
Keywords :
gradient index optics; integrated optoelectronics; optical communication equipment; optical fibre cladding; optical fibre networks; optical links; optical polymers; photodiodes; plastics; semiconductor lasers; telecommunication channels; assembly form complexity; assembly form factor; bit rate 10 Gbit/s; compact bidirectional optical subassemblies; compact form factor; direct butt-coupling; downstream channel; error-free signal transmission; eye opening; four-channel ribbon; full-duplex optical data link; graded-index cores; laser diodes; optoelectronic ferrule; photodiodes; size 125 mum; size 50 mum; thin GI plastic optical fibre ribbon; thin claddings; upstream channel;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el.2013.0583
Filename :
6553047
Link To Document :
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