• DocumentCode
    2233821
  • Title

    A new router for reducing “antenna effect” in ASIC design

  • Author

    Shirota, Hiroshi ; Sadakane, Toshiyuki ; Terai, Masayuki ; Okazaki, Kaoru

  • Author_Institution
    Mitsubishi Electr. Corp., Hyogo, Japan
  • fYear
    1998
  • fDate
    11-14 May 1998
  • Firstpage
    601
  • Lastpage
    604
  • Abstract
    In this paper, an efficient router for reducing “antenna effect” damage is reported. The antenna effect is a phenomenon of gate-oxide degradation by charge buildup on conductors in plasma-based manufacturing processes. It directly influences yield and reliability of VLSIs. The amount of the degradation is a direct function of interconnect geometry (e.g., amount of floating conductors connecting to the gate oxide during the processes). The proposed router combines a traditional router and a modification of wires for reducing the antenna effect damage using a rip-up and reroute method. It reduces the damage with only a small penalty of die size and performance. The effectiveness of the router, which is implemented in the layout system HGALOP, is demonstrated by experimental results on 3-4 level metal industrial sea-of-gates (SOG) circuits
  • Keywords
    application specific integrated circuits; circuit layout CAD; integrated circuit interconnections; integrated circuit layout; integrated circuit reliability; integrated circuit yield; logic CAD; logic arrays; network routing; ASIC design; HGALOP; antenna effect; charge buildup; gate-oxide degradation; industrial sea-of-gates circuits; interconnect geometry; plasma-based manufacturing processes; reliability; reroute method; rip-up method; router; yield; Application specific integrated circuits; Conductors; Degradation; Geometry; Integrated circuit interconnections; Joining processes; Manufacturing processes; Plasma materials processing; Very large scale integration; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 1998. Proceedings of the IEEE 1998
  • Conference_Location
    Santa Clara, CA
  • Print_ISBN
    0-7803-4292-5
  • Type

    conf

  • DOI
    10.1109/CICC.1998.695049
  • Filename
    695049