Title :
Interactive Forces Analysis and Haptic Modeling for Virtual Prototyping and Product Development
Author :
Lee, Yuan-Shin ; Lin, Shiyong ; Narayan, Roger
Author_Institution :
Ind. & Syst. Eng., North Carolina State Univ., Raleigh, NC, USA
Abstract :
In this paper, we present a haptic modeling for interactive forces on heterogeneous deformable product design and virtual prototyping. Techniques of both geometric and physical modeling of deformable heterogeneous materials are presented for virtual prototyping and product development. Haptic interactive forces and torques are calculated based on the deformation of heterogeneous materials with different material properties. Surface frictions are considered in the force rendering modeling to simulate physical properties of deformable objects. A lab-built 5-DOF (degree of freedom) haptic force-torque feedback interface is developed to allow the user to maneuver and test the virtual product models built for product development. Examples of using the presented techniques in medical applications were also discussed. The proposed techniques can be used in design and product evaluation, virtual prototyping, and other virtual reality applications where soft materials are involved.
Keywords :
CAD; biomedical engineering; force feedback; friction; haptic interfaces; product design; product development; production engineering computing; rendering (computer graphics); virtual prototyping; virtual reality; deformable heterogeneous materials; force rendering modeling; geometric modeling; haptic force-torque feedback interface; haptic modeling; heterogeneous deformable product design; interactive force analysis; material properties; medical application; physical modeling; product development; simulate physical; soft materials; surface friction; virtual product model; virtual prototyping; virtual reality application; haptic modeling; simulation and modeling; virtual product development; virtual prototyping;
Conference_Titel :
Manufacturing Automation (ICMA), 2010 International Conference on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-9018-9
Electronic_ISBN :
978-0-7695-4293-5
DOI :
10.1109/ICMA.2010.33