DocumentCode
2234153
Title
Automating after develop inspection
Author
Berezin, Alan ; Schaffer, Diana ; Villarreal, Asael
Author_Institution
Adv. Micro Devices Inc., Austin, TX, USA
fYear
1996
fDate
12-14 Nov 1996
Firstpage
103
Lastpage
106
Abstract
One of the few areas in the semiconductor manufacturing process where a mistake can still be corrected is the photolithography process module. If a faulty resist pattern is detected prior to being permanently etched, the resist pattern can be stripped and re-imaged. Historically, lots were manually inspected prior to leaving the photolithography module (after develop inspection) so as to detect any problems requiring rework. Automated inspections have been widely adopted at the after etch steps and at the films/deposition operations. This paper will describe the successful automation of the after develop inspection operation at AMD Fab 25 in Austin, Texas
Keywords
automatic optical inspection; computer testing; integrated circuit manufacture; integrated circuit testing; photoresists; production testing; AMD Fab 25; after develop inspection; after etch steps; automated inspections; deposition operations; photolithography process module; resist pattern; semiconductor manufacturing process; Automatic control; Etching; Fault detection; Inspection; Instruments; Lithography; Manufacturing processes; Resists; Sampling methods; Scanning electron microscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 1996. ASMC 96 Proceedings. IEEE/SEMI 1996
Conference_Location
Cambridge, MA
ISSN
1078-8743
Print_ISBN
0-7803-3371-3
Type
conf
DOI
10.1109/ASMC.1996.557981
Filename
557981
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