• DocumentCode
    2234153
  • Title

    Automating after develop inspection

  • Author

    Berezin, Alan ; Schaffer, Diana ; Villarreal, Asael

  • Author_Institution
    Adv. Micro Devices Inc., Austin, TX, USA
  • fYear
    1996
  • fDate
    12-14 Nov 1996
  • Firstpage
    103
  • Lastpage
    106
  • Abstract
    One of the few areas in the semiconductor manufacturing process where a mistake can still be corrected is the photolithography process module. If a faulty resist pattern is detected prior to being permanently etched, the resist pattern can be stripped and re-imaged. Historically, lots were manually inspected prior to leaving the photolithography module (after develop inspection) so as to detect any problems requiring rework. Automated inspections have been widely adopted at the after etch steps and at the films/deposition operations. This paper will describe the successful automation of the after develop inspection operation at AMD Fab 25 in Austin, Texas
  • Keywords
    automatic optical inspection; computer testing; integrated circuit manufacture; integrated circuit testing; photoresists; production testing; AMD Fab 25; after develop inspection; after etch steps; automated inspections; deposition operations; photolithography process module; resist pattern; semiconductor manufacturing process; Automatic control; Etching; Fault detection; Inspection; Instruments; Lithography; Manufacturing processes; Resists; Sampling methods; Scanning electron microscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 1996. ASMC 96 Proceedings. IEEE/SEMI 1996
  • Conference_Location
    Cambridge, MA
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-3371-3
  • Type

    conf

  • DOI
    10.1109/ASMC.1996.557981
  • Filename
    557981