DocumentCode :
2235780
Title :
Abnormal trend detection of sequence-disordered data using EWMA method [wafer fabrication]
Author :
Fan, Min, Jr. ; Guo, Ruey-Shan ; Chang, Shi-Chung ; Lee, Jian-Huei
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear :
1996
fDate :
12-14 Nov 1996
Firstpage :
169
Lastpage :
174
Abstract :
In this paper, we focus on the design issues of applying the exponentially weighted moving average (EWMA) chart to end-of-line electrical test data. Since the sequence of end-of-line test data is not the same as the sequence in each process step, an abnormal trend in any of the process steps is more difficult to detect based on end-of-line test data than based on single step process data (if available). Our approach uses EWMA chart because the moving average is able to smooth out the sequence-disordered effect and the weighting factor allows us to choose an effective moving average size. The correlation among weighting factor, detection speed, and sequence-disordered effect is studied. Fab data is used to verify the effectiveness of EWMA chart for detecting process shifts if we appropriately choose the weighting factor based on the derived correlation
Keywords :
integrated circuit manufacture; monitoring; moving average processes; process control; quality control; statistical analysis; statistical process control; EWMA method; abnormal trend detection; detection speed; electrical test data; end-of-line test data; exponentially weighted moving average chart; process shifts; sequence-disordered data; wafer fabrication; weighting factor; Data engineering; Manufacturing industries; Manufacturing processes; Monitoring; Process control; Pulp manufacturing; Quality control; Response surface methodology; Semiconductor device manufacture; Semiconductor device testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1996. ASMC 96 Proceedings. IEEE/SEMI 1996
Conference_Location :
Cambridge, MA
ISSN :
1078-8743
Print_ISBN :
0-7803-3371-3
Type :
conf
DOI :
10.1109/ASMC.1996.557991
Filename :
557991
Link To Document :
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