• DocumentCode
    2235780
  • Title

    Abnormal trend detection of sequence-disordered data using EWMA method [wafer fabrication]

  • Author

    Fan, Min, Jr. ; Guo, Ruey-Shan ; Chang, Shi-Chung ; Lee, Jian-Huei

  • Author_Institution
    Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • fYear
    1996
  • fDate
    12-14 Nov 1996
  • Firstpage
    169
  • Lastpage
    174
  • Abstract
    In this paper, we focus on the design issues of applying the exponentially weighted moving average (EWMA) chart to end-of-line electrical test data. Since the sequence of end-of-line test data is not the same as the sequence in each process step, an abnormal trend in any of the process steps is more difficult to detect based on end-of-line test data than based on single step process data (if available). Our approach uses EWMA chart because the moving average is able to smooth out the sequence-disordered effect and the weighting factor allows us to choose an effective moving average size. The correlation among weighting factor, detection speed, and sequence-disordered effect is studied. Fab data is used to verify the effectiveness of EWMA chart for detecting process shifts if we appropriately choose the weighting factor based on the derived correlation
  • Keywords
    integrated circuit manufacture; monitoring; moving average processes; process control; quality control; statistical analysis; statistical process control; EWMA method; abnormal trend detection; detection speed; electrical test data; end-of-line test data; exponentially weighted moving average chart; process shifts; sequence-disordered data; wafer fabrication; weighting factor; Data engineering; Manufacturing industries; Manufacturing processes; Monitoring; Process control; Pulp manufacturing; Quality control; Response surface methodology; Semiconductor device manufacture; Semiconductor device testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 1996. ASMC 96 Proceedings. IEEE/SEMI 1996
  • Conference_Location
    Cambridge, MA
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-3371-3
  • Type

    conf

  • DOI
    10.1109/ASMC.1996.557991
  • Filename
    557991