DocumentCode
2235999
Title
Semiconductor factory automation: designing for phased automation
Author
Gardner, D.C.
Author_Institution
Hewlett-Packard Co., Corvalis, OR, USA
fYear
1996
fDate
12-14 Nov 1996
Firstpage
207
Lastpage
213
Abstract
Hewlett-Packard has developed a strategy for phased semiconductor factory automation design and implementation. This strategy allows a semiconductor factory to incorporate progressive levels of factory control software components, automated material handling systems, and real-time process tool control to meet the growing and changing needs of a semiconductor facility. This paper discusses the benefits, interfaces, components and return on investment associated with automation phasing. Included are discussions on modular tool interfaces and control, distributed factory control systems, modular automated material handling systems, distributed stocking, facility systems design, rapid manual contingency operations, reliability considerations and cost benefits of phased approaches
Keywords
cost-benefit analysis; economics; factory automation; integrated circuit manufacture; materials handling; process control; real-time systems; strategic planning; Hewlett-Packard; automated material handling systems; cost benefits; distributed factory control systems; distributed stocking; facility systems design; factory control software components; manual contingency operations; modular tool interfaces; phased automation; progressive levels; real-time process tool control; reliability considerations; return on investment; semiconductor facility; semiconductor factory automation; strategy; Automatic control; Control systems; Design automation; Distributed control; Manufacturing automation; Materials handling; Process control; Production facilities; Real time systems; Software tools;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 1996. ASMC 96 Proceedings. IEEE/SEMI 1996
Conference_Location
Cambridge, MA
ISSN
1078-8743
Print_ISBN
0-7803-3371-3
Type
conf
DOI
10.1109/ASMC.1996.558000
Filename
558000
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