• DocumentCode
    2236122
  • Title

    Manufacturing scrap reduction team

  • Author

    Daigle, Keith ; Powell, Robert

  • Author_Institution
    Microelectron. Div., IBM Corp., Essex Junction, VT, USA
  • fYear
    1996
  • fDate
    12-14 Nov 1996
  • Firstpage
    230
  • Lastpage
    232
  • Abstract
    In today´s highly competitive: marketplace, working better, smarter, and more cost effectively is essential. The scrap created during manufacturing can either sharpen or diminish a company´s competitive edge. Customers require that their orders be delivered on time with yield quality that either meets or exceeds specifications. In Hot Process, scrap and hold lots were becoming a very serious problem that affected the manufacturing team´s performance, customers orders, and delivery schedule. To alleviate this problem, each project was directed to address its part of this critical defect issue. The Hot Process project with manufacturing production control, acting as an empowered self-directed group, formed a market-driven team for scrap which could help improve production yields and reduce defects. Issues identified by the team included the lack of a unified procedure for documenting scrap, wafer-handling concerns suggested by new and experienced operators, and how best to focus on single wafer scrap and the cause of that scrap, and its correction or prevention. This paper describes the team´s plan (or unified assault) to increase yields by reducing defects and how a common accounting procedure was implemented to review existing departmental practices which could result in a common scrap procedure. Also addressed are the several wafer-handling issues which resulted in revised wafer-handling class that more adequately reflects the nature of today´s defects and enhances operator understanding of the the underlying costs associated with how scrap affects yield. Finally, this paper discusses the measurement and reporting of our Hot Process scrap team´s yield improvements and defect reductions at bimonthly meetings with management
  • Keywords
    economics; integrated circuit yield; materials handling; production control; accounting procedure; critical defect issue; delivery schedule; empowered self-directed group; hold lots; hot process; manufacturing production control; market-driven team; production yields; scrap reduction; wafer-handling concerns; yield quality; Assembly; Control systems; Costs; Degradation; Job shop scheduling; Manufacturing processes; Microelectronics; Production control; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 1996. ASMC 96 Proceedings. IEEE/SEMI 1996
  • Conference_Location
    Cambridge, MA
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-3371-3
  • Type

    conf

  • DOI
    10.1109/ASMC.1996.558006
  • Filename
    558006