Cost effective monitoring

Author

Nelsen, David C.

Author_Institution

Intel Corp., Rio Rancho, NM, USA

fYear

1996

fDate

12-14 Nov 1996

Firstpage

233

Lastpage

235

Abstract

Output monitoring does not address the excursion risks present in today´s semiconductor manufacturing environment. To address this, the industry must transition to input monitoring and subsequently design robustness to improve the duality and reliability of process equipment output. A step in the right direction is represented by in-situ monitoring of radio frequency power of plasma deposition and etch equipment. This allows for real time monitoring and significantly reduces the risks that output monitoring alone poses

Keywords

design for manufacture; integrated circuit manufacture; integrated circuit reliability; monitoring; real-time systems; sputter deposition; sputter etching; cost effective monitoring; design robustness; excursion risks; in-situ monitoring; input monitoring; output monitoring; plasma deposition; plasma etch equipment; process equipment output; real time monitoring; reliability; semiconductor manufacturing environment; Costs; Industrial control; Materials testing; Monitoring; Plasma chemistry; Process control; Production materials; Radio frequency; Robustness; Semiconductor device testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference and Workshop, 1996. ASMC 96 Proceedings. IEEE/SEMI 1996

Conference_Location

Cambridge, MA

ISSN

1078-8743

Print_ISBN

0-7803-3371-3

Type

conf

DOI

10.1109/ASMC.1996.558008

Filename

558008