Title :
Cost effective monitoring
Author :
Nelsen, David C.
Author_Institution :
Intel Corp., Rio Rancho, NM, USA
Abstract :
Output monitoring does not address the excursion risks present in today´s semiconductor manufacturing environment. To address this, the industry must transition to input monitoring and subsequently design robustness to improve the duality and reliability of process equipment output. A step in the right direction is represented by in-situ monitoring of radio frequency power of plasma deposition and etch equipment. This allows for real time monitoring and significantly reduces the risks that output monitoring alone poses
Keywords :
design for manufacture; integrated circuit manufacture; integrated circuit reliability; monitoring; real-time systems; sputter deposition; sputter etching; cost effective monitoring; design robustness; excursion risks; in-situ monitoring; input monitoring; output monitoring; plasma deposition; plasma etch equipment; process equipment output; real time monitoring; reliability; semiconductor manufacturing environment; Costs; Industrial control; Materials testing; Monitoring; Plasma chemistry; Process control; Production materials; Radio frequency; Robustness; Semiconductor device testing;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1996. ASMC 96 Proceedings. IEEE/SEMI 1996
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-3371-3
DOI :
10.1109/ASMC.1996.558008
