DocumentCode
2236444
Title
An IEEE 1500 compatible wrapper architecture for testing cores at transaction level
Author
Refan, F. ; Prinetto, P. ; Navabi, Zainalabedin
Author_Institution
ECE Dept., Univ. of Tehran, Tehran, Iran
fYear
2008
fDate
9-12 Oct. 2008
Firstpage
178
Lastpage
181
Abstract
With the evolution of Electronic System Level (ESL) design methodologies, Transaction Level Modeling (TLM) is regarded as the next step in the direction of system level design. This requires definition of appropriate test strategies at this level including wrapper, scheduling and Test Access Mechanism (TAM) design. In this paper we propose a wrapper for core testing at transaction level, compatible with IEEE 1500 standard architecture. The proposed wrapper is designed to support communication with tlm_fifo as the basic primitive channel of SystemC TLM core. The wrapper is defined as a layer on top of standard IEEE 1500 architecture, including a controller to packetize and depacketize the test stimuli and responses. Controller design, and architecture configuration for serial and parallel core test instructions are presented. Using the same strategy other instructions can be implemented.
Keywords
IEEE standards; logic design; logic testing; system-on-chip; ESL design methodology; IEEE 1500 standard architecture; core testing; electronic system level; parallel core test instruction; scheduling mechanism; serial core test instruction; test access mechanism; transaction level modeling; wrapper architecture; wrapper mechanism; Complexity theory; Hardware; Object oriented modeling; System-on-a-chip; Testing; Time domain analysis; Time varying systems;
fLanguage
English
Publisher
ieee
Conference_Titel
Design & Test Symposium (EWDTS), 2008 East-West
Conference_Location
Lviv
Print_ISBN
978-1-4244-3402-2
Electronic_ISBN
978-1-4244-3403-9
Type
conf
DOI
10.1109/EWDTS.2008.5580141
Filename
5580141
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