DocumentCode
2236614
Title
Reliability Study of 0.15um MHEMT with Vds≫3V Bias for Amplifier Application
Author
Chen, S.C. ; Chou, H.C. ; Chou, Frank ; Hsieh, Iris ; Tu, D.W. ; Wang, Y.C. ; Wu, C.S. ; Nelson, S.R.
Author_Institution
WIN Semicond. Corp. #69, Tao Yuan Shien
fYear
2007
fDate
14-14 Oct. 2007
Firstpage
47
Lastpage
63
Abstract
MHEMT technology using metamorphic buffer layers growing on GaAs substrate can overcome InP substrate issues. Several researchers have demonstrated reliable MHEMT devices, mainly with the drain bias at 1 V. This work, however, demonstrated for the first time MHEMT devices operated at drain voltage greater than 3 V for the amplifier application. We have demonstrated the power MHEMT at 3.5V drain bias with Ea of 1.53eV and MTTF of 2.32x106 hours at Teh of 125degC on WIN Semiconductors´1 technology. We also found that stressed voltage bias plays a more important role than the current density in short-term reliability evaluation.
Keywords
amplifiers; buffer layers; power HEMT; semiconductor technology; MHEMT technology; amplifier application; drain voltage; metamorphic buffer layers; reliability study; semiconductor technology; voltage bias; Current density; Gallium arsenide; Space technology; Substrates; Temperature; Testing; Thermal degradation; Thermal stresses; Voltage; mHEMTs;
fLanguage
English
Publisher
ieee
Conference_Titel
ROCS Workshop, 2007.[Reliability of Compound Semiconductors Digest]
Conference_Location
Portland, OR
Print_ISBN
978-0-7908-0115-5
Type
conf
DOI
10.1109/ROCS.2007.4391061
Filename
4391061
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