• DocumentCode
    2236614
  • Title

    Reliability Study of 0.15um MHEMT with Vds≫3V Bias for Amplifier Application

  • Author

    Chen, S.C. ; Chou, H.C. ; Chou, Frank ; Hsieh, Iris ; Tu, D.W. ; Wang, Y.C. ; Wu, C.S. ; Nelson, S.R.

  • Author_Institution
    WIN Semicond. Corp. #69, Tao Yuan Shien
  • fYear
    2007
  • fDate
    14-14 Oct. 2007
  • Firstpage
    47
  • Lastpage
    63
  • Abstract
    MHEMT technology using metamorphic buffer layers growing on GaAs substrate can overcome InP substrate issues. Several researchers have demonstrated reliable MHEMT devices, mainly with the drain bias at 1 V. This work, however, demonstrated for the first time MHEMT devices operated at drain voltage greater than 3 V for the amplifier application. We have demonstrated the power MHEMT at 3.5V drain bias with Ea of 1.53eV and MTTF of 2.32x106 hours at Teh of 125degC on WIN Semiconductors´1 technology. We also found that stressed voltage bias plays a more important role than the current density in short-term reliability evaluation.
  • Keywords
    amplifiers; buffer layers; power HEMT; semiconductor technology; MHEMT technology; amplifier application; drain voltage; metamorphic buffer layers; reliability study; semiconductor technology; voltage bias; Current density; Gallium arsenide; Space technology; Substrates; Temperature; Testing; Thermal degradation; Thermal stresses; Voltage; mHEMTs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ROCS Workshop, 2007.[Reliability of Compound Semiconductors Digest]
  • Conference_Location
    Portland, OR
  • Print_ISBN
    978-0-7908-0115-5
  • Type

    conf

  • DOI
    10.1109/ROCS.2007.4391061
  • Filename
    4391061