• DocumentCode
    2236936
  • Title

    Infrared Thermal Measurement System for Evaluating Model-Based Thermal Displays

  • Author

    Ho, Hsin-Ni ; Jones, Lynette A.

  • Author_Institution
    Dept. of Mech. Eng., Massachusetts Inst. of Technol., Cambridge, MA
  • fYear
    2007
  • fDate
    22-24 March 2007
  • Firstpage
    157
  • Lastpage
    163
  • Abstract
    A thermal measurement system was designed and fabricated to assist in the validation of a thermal model in characterizing skin temperature during hand-object interactions. An infrared measurement system was used to overcome the limitations imposed by contact thermal sensors. It is able to measure the temperature distribution across the fingerpad during contact, together with contact area and contact force. The performance of this system was evaluated with calibration tests and the results indicated that this system is capable of providing accurate temperature measurements. With this system, analyses of the changes in skin temperature as a function of contact pressure were conducted. These analyses permitted the validation of a thermal model proposed in a previous study and the results indicate that the thermal model is able to predict skin temperature during contact. The model can simulate the properties of different materials in a thermal display
  • Keywords
    temperature distribution; temperature measurement; thermal analysis; contact area; contact force; contact pressure; contact thermal sensor; fingerpad; hand-object interaction; infrared thermal measurement system; model-based thermal display; skin temperature; temperature distribution; temperature measurement; thermal model; Displays; Force measurement; Infrared sensors; Predictive models; Sensor phenomena and characterization; Sensor systems; Skin; Temperature measurement; Temperature sensors; Thermal sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    EuroHaptics Conference, 2007 and Symposium on Haptic Interfaces for Virtual Environment and Teleoperator Systems. World Haptics 2007. Second Joint
  • Conference_Location
    Tsukaba
  • Print_ISBN
    0-7695-2738-8
  • Type

    conf

  • DOI
    10.1109/WHC.2007.76
  • Filename
    4145168