Title :
Defect reduction through statistical process control and prior-level subtraction analysis
Author_Institution :
Microelectron. Div., IBM Corp., Essex Junction, VT, USA
Abstract :
This paper discusses the reduction of defects in a nitride etching process using statistical process control (SPC). How defects are reduced in a contact process is also described
Keywords :
etching; inspection; integrated circuit manufacture; integrated circuit metallisation; process control; statistical analysis; statistical process control; SPC; contact process; defect reduction; nitride etching process; prior-level subtraction analysis; statistical process control; Data engineering; Etching; Failure analysis; Inspection; Maintenance engineering; Manufacturing processes; Microelectronics; Monitoring; Process control; Semiconductor device manufacture;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1996. ASMC 96 Proceedings. IEEE/SEMI 1996
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-3371-3
DOI :
10.1109/ASMC.1996.558023
