DocumentCode
2237160
Title
Defect reduction through statistical process control and prior-level subtraction analysis
Author
Shanks, David
Author_Institution
Microelectron. Div., IBM Corp., Essex Junction, VT, USA
fYear
1996
fDate
12-14 Nov 1996
Firstpage
293
Lastpage
296
Abstract
This paper discusses the reduction of defects in a nitride etching process using statistical process control (SPC). How defects are reduced in a contact process is also described
Keywords
etching; inspection; integrated circuit manufacture; integrated circuit metallisation; process control; statistical analysis; statistical process control; SPC; contact process; defect reduction; nitride etching process; prior-level subtraction analysis; statistical process control; Data engineering; Etching; Failure analysis; Inspection; Maintenance engineering; Manufacturing processes; Microelectronics; Monitoring; Process control; Semiconductor device manufacture;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 1996. ASMC 96 Proceedings. IEEE/SEMI 1996
Conference_Location
Cambridge, MA
ISSN
1078-8743
Print_ISBN
0-7803-3371-3
Type
conf
DOI
10.1109/ASMC.1996.558023
Filename
558023
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