DocumentCode
2237301
Title
Review of 3D high density storage class memory (SCM) architecture
Author
Lee, Brian
Author_Institution
Petari USA
fYear
2012
fDate
23-25 April 2012
Firstpage
1
Lastpage
1
Abstract
This paper describes a fundamental building block and architecture of future high density storage class memory products. A review of 3D architecture is presented. A detailed review of cross point select devices and memory cells are conducted followed by their integration scheme. A critical review of its challenges and potential solutions are proposed.
Keywords
Abstracts; Architecture; Buildings;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems, and Applications (VLSI-TSA), 2012 International Symposium on
Conference_Location
Hsinchu, Taiwan
ISSN
1930-8868
Print_ISBN
978-1-4577-2083-3
Type
conf
DOI
10.1109/VLSI-TSA.2012.6210107
Filename
6210107
Link To Document