• DocumentCode
    2237301
  • Title

    Review of 3D high density storage class memory (SCM) architecture

  • Author

    Lee, Brian

  • Author_Institution
    Petari USA
  • fYear
    2012
  • fDate
    23-25 April 2012
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    This paper describes a fundamental building block and architecture of future high density storage class memory products. A review of 3D architecture is presented. A detailed review of cross point select devices and memory cells are conducted followed by their integration scheme. A critical review of its challenges and potential solutions are proposed.
  • Keywords
    Abstracts; Architecture; Buildings;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems, and Applications (VLSI-TSA), 2012 International Symposium on
  • Conference_Location
    Hsinchu, Taiwan
  • ISSN
    1930-8868
  • Print_ISBN
    978-1-4577-2083-3
  • Type

    conf

  • DOI
    10.1109/VLSI-TSA.2012.6210107
  • Filename
    6210107