• DocumentCode
    2237415
  • Title

    The integration of SNMP and Web in embedded devices

  • Author

    Hong, Liu ; Dong, Bai ; Wei, Ding

  • Author_Institution
    Beijing Univ. of Posts & Telecommun., China
  • Volume
    2
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    83
  • Abstract
    SNMP (simple network management protocol) is nowadays the key enabling technology, while, with the development of embedded Internet, manufacturers are required to "Web-enable" the configuration and management of their products. Thus the integration of SNMP and Web in embedded devices will make products competitive. An integrated embedded management model to provide a unified device management framework is presented in this article. This model consists of six functional modules including RTOS (real-time operating system), OS abstraction layer, application layer, data layer, middle layer and access layer. Each module is described, and the relation with each other as well. A development platform provided by WindRiver Systems is introduced, which enables products to be developed cost-effectively and efficiently with shortened time-to-market
  • Keywords
    Internet; business communication; computer network management; embedded systems; network operating systems; protocols; telecommunication computing; telecommunication equipment; OS abstraction layer; SNMP; Web-enabled device configuration; Web-enabled device management; WindRiver Systems development platform; access layer; application layer; corporate network; data layer; embedded Internet; embedded devices; middle layer; network equipment; real-time operating system; simple network management protocol; Access protocols; Disaster management; Electronic mail; Embedded system; Flexible manufacturing systems; Internet; Manufacturing industries; Power system management; Technology management; Time to market;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Info-tech and Info-net, 2001. Proceedings. ICII 2001 - Beijing. 2001 International Conferences on
  • Conference_Location
    Beijing
  • Print_ISBN
    0-7803-7010-4
  • Type

    conf

  • DOI
    10.1109/ICII.2001.983558
  • Filename
    983558