DocumentCode :
2238686
Title :
IGBT module setup with integrated micro-heat sinks
Author :
Steiner, T. ; Sittig, R.
Author_Institution :
Inst. fur Elektrophys., Tech. Univ. Braunschweig, Germany
fYear :
2000
fDate :
2000
Firstpage :
209
Lastpage :
212
Abstract :
Chances of liquid cooling integrated into power modules were investigated during an extended research project. It turned out that a flowing liquid yields better characteristics than a boiling liquid and that water offers superior thermal properties compared to electrical isolating fluids although the latter would allow to omit the isolating ceramic layer. Experimental investigations as well as numerical simulations revealed that the coefficient of heat transfer from solid to liquid can be increased by more than an order of magnitude compared to usually given numbers. To this goal a suited geometry of flow channels and a sufficiently high velocity of the liquid have to be chosen. A corresponding micro-heat sink for double sided cooling of an IGBT and a diode was constructed. The height of the total setup amounts to about 9 mm and with a 12×12 mm2 test chip a thermal resistance of 0.087 K/W was achieved
Keywords :
heat sinks; insulated gate bipolar transistors; modules; semiconductor device packaging; IGBT; double sided cooling; flow channel; heat transfer; integrated micro-heat sink; liquid cooling; numerical simulation; power module; thermal resistance; Ceramics; Geometry; Heat transfer; Insulated gate bipolar transistors; Liquid cooling; Multichip modules; Numerical simulation; Solids; Thermal resistance; Water;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs, 2000. Proceedings. The 12th International Symposium on
Conference_Location :
Toulouse
ISSN :
1063-6854
Print_ISBN :
0-7803-6269-1
Type :
conf
DOI :
10.1109/ISPSD.2000.856808
Filename :
856808
Link To Document :
بازگشت