DocumentCode
2238793
Title
MEMS module integration into SiGe BiCMOS technology for embedded system applications
Author
Kaynak, Mehmet ; Valenta, Vaclav ; Schumacher, Hermann ; Tillack, Bernd
Author_Institution
IHP GmbH, Leibniz Inst. for Innovative Microelectron., Frankfurt/Oder, Germany
fYear
2012
fDate
Sept. 30 2012-Oct. 3 2012
Firstpage
1
Lastpage
7
Abstract
The introduction of radio frequency micro-electro-mechanical systems (RFMEMS) as a monolithic option into state-of-the-art Si/SiGe BiCMOS foundry processes has paved the way for single chip radio frequency microsystems at millimeter wave frequencies. Deep silicon substrate etch techniques have also been developed to prevent high substrate losses which help in achieving high performance passive components at mm-wave frequencies. Using the same process techniques, realization of highly efficient on-chip antennas has become feasible, which in the millimeter-wave range no longer come with a hefty chip real estate penalty. In this paper, the current status of embedded BiCMOS+MEMS technology development is presented. Reconfigurable circuits using embedded RFMEMS switches and mm-wave transceivers with on-chip antennas are also discussed as application examples.
Keywords
BiCMOS integrated circuits; Ge-Si alloys; embedded systems; field effect MIMIC; microswitches; millimetre wave antennas; silicon; BiCMOS foundry processes; MEMS module integration; Si-SiGe; deep silicon substrate etch techniques; embedded RF MEMS switches; embedded system applications; high performance passive components; highly efficient on-chip antennas; millimeter wave frequencies; mm-wave transceivers; radiofrequency microelectromechanical systems; reconfigurable circuits; single chip radiofrequency microsystems; BiCMOS integrated circuits; Inductors; Micromechanical devices; Silicon; Substrates; Switches; System-on-a-chip; On-Chip antennas; RFMEMS; RFMEMS switch; Silicon bipolar/BiCMOS process technology; mm-wave ICs; reconfigurable ICs;
fLanguage
English
Publisher
ieee
Conference_Titel
Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2012 IEEE
Conference_Location
Portland, OR
ISSN
1088-9299
Print_ISBN
978-1-4673-3020-6
Type
conf
DOI
10.1109/BCTM.2012.6352617
Filename
6352617
Link To Document