Comparison between finite-element and analytical calculations for the lifetime estimation of bond wires in IGBT modules

Author

Hager, C. ; Stuck, A. ; Tronel, Y. ; Zehringer, R. ; Fichtner, W.

Author_Institution

Integrated Syst. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland

fYear

2000

fDate

2000

Firstpage

291

Lastpage

294

Abstract

Coffin-Manson fatigue law based lifetime estimations of aluminum bond wires in IGBT modules under field conditions were performed. The models were calibrated with fatigue data obtained from accelerated lifetime tests and plastic strain computations corresponding to test conditions. The calibrated laws were then used to predict the bond wire lifetime under field conditions. To evaluate the influence of the plastic strain calculations, finite-element and analytical computations were performed and the resulting lifetimes compared

Keywords

aluminium; failure analysis; fatigue; finite element analysis; insulated gate bipolar transistors; lead bonding; life testing; modules; plastic deformation; power transistors; semiconductor device packaging; Al; Al bond wires; Coffin-Manson fatigue law; FEM; IGBT modules; accelerated lifetime tests; analytical calculations; field conditions; finite-element calculations; lifetime estimation; plastic strain computations; Aluminum; Bonding; Capacitive sensors; Fatigue; Finite element methods; Insulated gate bipolar transistors; Life estimation; Lifetime estimation; Plastics; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Semiconductor Devices and ICs, 2000. Proceedings. The 12th International Symposium on

Conference_Location

Toulouse

ISSN

1063-6854

Print_ISBN

0-7803-6269-1

Type

conf

DOI

10.1109/ISPSD.2000.856828

Filename

856828