DocumentCode :
2239178
Title :
Comparison between finite-element and analytical calculations for the lifetime estimation of bond wires in IGBT modules
Author :
Hager, C. ; Stuck, A. ; Tronel, Y. ; Zehringer, R. ; Fichtner, W.
Author_Institution :
Integrated Syst. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland
fYear :
2000
fDate :
2000
Firstpage :
291
Lastpage :
294
Abstract :
Coffin-Manson fatigue law based lifetime estimations of aluminum bond wires in IGBT modules under field conditions were performed. The models were calibrated with fatigue data obtained from accelerated lifetime tests and plastic strain computations corresponding to test conditions. The calibrated laws were then used to predict the bond wire lifetime under field conditions. To evaluate the influence of the plastic strain calculations, finite-element and analytical computations were performed and the resulting lifetimes compared
Keywords :
aluminium; failure analysis; fatigue; finite element analysis; insulated gate bipolar transistors; lead bonding; life testing; modules; plastic deformation; power transistors; semiconductor device packaging; Al; Al bond wires; Coffin-Manson fatigue law; FEM; IGBT modules; accelerated lifetime tests; analytical calculations; field conditions; finite-element calculations; lifetime estimation; plastic strain computations; Aluminum; Bonding; Capacitive sensors; Fatigue; Finite element methods; Insulated gate bipolar transistors; Life estimation; Lifetime estimation; Plastics; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs, 2000. Proceedings. The 12th International Symposium on
Conference_Location :
Toulouse
ISSN :
1063-6854
Print_ISBN :
0-7803-6269-1
Type :
conf
DOI :
10.1109/ISPSD.2000.856828
Filename :
856828
Link To Document :
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