Title :
Characterization of langasite as a material for SAW based RFID and sensing systems at high temperatures
Author :
Mayer, Elena ; Shrena, Ismail ; Eisele, David ; Bardong, Jochen ; Schmitt, Martin ; Reindl, Leonhard M.
Author_Institution :
Dept. of Microsyst. Eng., Univ. of Freiburg, Freiburg, Germany
Abstract :
For langasite, a piezocrystal used as substrate material for SAW-based ID tags and sensors operating at high temperatures, the parameters of SAW propagation have been determined as a function of temperature. These parameters are the phase velocity, propagation loss, and electromechanical coupling coefficient. Two crystal cuts have been studied, with Euler angles (0deg, 138.5deg, 26.6deg) and (0deg, 30.2deg, 26.6deg). The SAW parameters were obtained from the measurements of transfer functions for delay lines on langasite chips at frequencies ranging from 150 MHz to 1 GHz and at temperatures from room temperature up to 750degC.
Keywords :
piezoelectric devices; radiofrequency identification; radiowave propagation; substrates; surface acoustic wave sensors; surface acoustic wave signal processing; transfer functions; Euler angle; SAW-based RFID; electromechanical coupling coefficient; electronic analog signal processing; frequency 150 MHz to 1 GHz; langasite chip; phase velocity; piezocrystal substrate material; propagation loss; radiofrequency identification; sensing system; surface acoustic wave technology; temperature 750 C; transfer function; Crystalline materials; Electromechanical sensors; Frequency measurement; Propagation losses; Radiofrequency identification; Semiconductor device measurement; Sensor phenomena and characterization; Surface acoustic waves; Temperature distribution; Temperature sensors; Acoustical parameters; SAW; high temperature; langasite; material properties;
Conference_Titel :
Wireless Sensing, Local Positioning, and RFID, 2009. IMWS 2009. IEEE MTT-S International Microwave Workshop on
Conference_Location :
Cavtat
Print_ISBN :
978-1-4244-5060-2
Electronic_ISBN :
978-1-4244-5062-6
DOI :
10.1109/IMWS2.2009.5307882