Title :
Automated metrology qualification strategy [IC measurement]
Author :
Chain, Elizabeth E.
Author_Institution :
Motorola Inc., Chandler, AZ, USA
Abstract :
This paper presents the methodology used to perform qualification of critical dimension (CD) SEM (Scanning Electron Microscope) tools for sub-0.5 μm process control. A submicron pitch standard has been characterized and incorporated into an automated tool calibration and qualification procedure. After first matching individual tools to the standard, daily tool qualification is performed on a CD qualification wafer. SPC (Statistical Process Control) charts are set up to subtract line broadening effects encountered in repeated SEM measurement. The automated calibration and qualification procedures described here permit accurate measurements to be provided as is required for effective metrology support of the modern factory
Keywords :
ULSI; calibration; inspection; integrated circuit manufacture; integrated circuit measurement; process control; scanning electron microscopy; spatial variables measurement; statistical process control; 0.5 micron; CD SEM tools; CD qualification wafer; CD scanning electron microscope tools; SPC charts; ULSI patterns inspection; automated metrology qualification strategy; automated qualification procedures; automated tool calibration; critical dimension SEM tools; line broadening effects; repeated SEM measurement; statistical process control charts; submicron pitch standard; submicron process control; Calibration; Fabrication; Metrology; NIST; Pollution measurement; Process control; Production facilities; Qualifications; Scanning electron microscopy; Ultra large scale integration;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1996. ASMC 96 Proceedings. IEEE/SEMI 1996
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-3371-3
DOI :
10.1109/ASMC.1996.558034
