Automated metrology for increased throughput and reliability

The increasing capacity of modern wafer fabrication facilities requires automated metrology methods. Automation provides a significantly improved measurement capability, coupled with increased manufacturing throughput, compared to standard methods. Successful integration of automated metrology into the factory measurement system requires that automated functions, such as pattern recognition, display a high degree of reliability. Data is required on automation, and can be collected on every part measured, along with the collection of measurement data. Reliability data analysis permits rapid identification of automation weaknesses, leading to rapid improvements. This analysis can be applied to such in-line measurements as CD (critical dimension), overlay, particle and film thickness. Results are presented for the CD SEM (Scanning Electron Microscope)