Title :
ISBN 0-7803-8686-8 [Back Cover]
Abstract :
Presents the back cover of the proceedings.
Conference_Titel :
High Performance Interconnects, 2004. Proceedings. 12th Annual IEEE Symposium on
Conference_Location :
Stanford, CA, USA
Print_ISBN :
0-7803-8686-8
DOI :
10.1109/CONECT.2004.1375219