Title :
European Workshop Materials for Advanced Metallization. MAM´97 Abstracts Booklet
Abstract :
Presents the front cover and table of contents of the proceedings.
Keywords :
ULSI; dielectric thin films; diffusion barriers; integrated circuit interconnections; integrated circuit metallisation; IC metallisation; dielectrics; diffusion barriers; silicides;
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
DOI :
10.1109/MAM.1997.621040
