Title :
Copper CVD precursors and processes for advanced metallization
Author_Institution :
Lab. de Chimie Inorg., CNRS, Paris, France
Abstract :
Chemical research to identify the "ideal" precursor for copper CVD is still actively being pursued by our group and others. We give here our last results on the performances of new precursors. The major goal of this research is to provide a material which enables the reproducible manufacturing of thin-film copper circuitry with defect-free filling of vias, low electrical resistivity and long-term reliability. Furthermore, the critical understanding of the chemical and physical properties for these CVD precursors may enable precursors with vastly improved properties to be synthesized.
Keywords :
chemical vapour deposition; copper; metallisation; Cu; copper CVD precursor; electrical resistivity; metallization; reliability; thin-film circuitry; via; Chemical reactors; Chemical vapor deposition; Copper; Design optimization; Equations; Inorganic materials; Integrated circuit interconnections; Integrated circuit metallization; Liquids; Termination of employment;
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
DOI :
10.1109/MAM.1997.621045