DocumentCode :
2240665
Title :
Copper CVD precursors and processes for advanced metallization
Author :
Doppelt, P.
Author_Institution :
Lab. de Chimie Inorg., CNRS, Paris, France
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
23
Lastpage :
24
Abstract :
Chemical research to identify the "ideal" precursor for copper CVD is still actively being pursued by our group and others. We give here our last results on the performances of new precursors. The major goal of this research is to provide a material which enables the reproducible manufacturing of thin-film copper circuitry with defect-free filling of vias, low electrical resistivity and long-term reliability. Furthermore, the critical understanding of the chemical and physical properties for these CVD precursors may enable precursors with vastly improved properties to be synthesized.
Keywords :
chemical vapour deposition; copper; metallisation; Cu; copper CVD precursor; electrical resistivity; metallization; reliability; thin-film circuitry; via; Chemical reactors; Chemical vapor deposition; Copper; Design optimization; Equations; Inorganic materials; Integrated circuit interconnections; Integrated circuit metallization; Liquids; Termination of employment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1997.621045
Filename :
621045
Link To Document :
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