Title :
Software-based development of 3D integration flows
Author :
Grunewald, Armin ; Kai Hahn ; Bruck, Roman
Author_Institution :
Inst. of Microsyst. Eng., Univ. of Siegen, Siegen, Germany
Abstract :
In recent years 3D IC design and manufacturing is continuously emerging. Along with the variety of possibilities on how to vertically integrate two or more dies, many aspects including cost, design and choice of technology must be considered. Therefore a design methodology and software implementation is presented in this paper which makes use of the mutual dependency of design and process technology in order to provide a manufacturable integration flow.
Keywords :
electronic engineering computing; integrated circuit design; integrated circuit manufacture; production engineering computing; three-dimensional integrated circuits; 3D IC design; 3D IC manufacturing; 3D integration flows; manufacturable integration flow; software-based development;
Conference_Titel :
Electronic Manufacturing Technology Symposium (IEMT), 2012 35th IEEE/CPMT International
Conference_Location :
Ipoh
Print_ISBN :
978-1-4673-4384-8
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2012.6521773
