Title :
Combined molding package (proximity sensor)
Author :
Lee, YF ; Kum, CC
Author_Institution :
Carsem Technology Center, Carsem (M) Sdn Bhd S-Site (Ipoh/Perak/Malaysia), Lot 52986, Taman Meru Industrial Estate, Jelapang, Malaysia
Abstract :
Proximity sensors, which are designed to detect the presence of nearby objects without any physical contact. Proximity sensor basically employ an Infra Red LED transceiver and Light receiver to achieve proximity detection purpose.
Conference_Titel :
Electronic Manufacturing Technology Symposium (IEMT), 2012 35th IEEE/CPMT International
Conference_Location :
Ipoh, Perak, Malaysia
Print_ISBN :
978-1-4673-4384-8
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2012.6521787
