• DocumentCode
    2241072
  • Title

    Combined molding package (proximity sensor)

  • Author

    Lee, YF ; Kum, CC

  • Author_Institution
    Carsem Technology Center, Carsem (M) Sdn Bhd S-Site (Ipoh/Perak/Malaysia), Lot 52986, Taman Meru Industrial Estate, Jelapang, Malaysia
  • fYear
    2012
  • fDate
    6-8 Nov. 2012
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Proximity sensors, which are designed to detect the presence of nearby objects without any physical contact. Proximity sensor basically employ an Infra Red LED transceiver and Light receiver to achieve proximity detection purpose.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium (IEMT), 2012 35th IEEE/CPMT International
  • Conference_Location
    Ipoh, Perak, Malaysia
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4673-4384-8
  • Electronic_ISBN
    1089-8190
  • Type

    conf

  • DOI
    10.1109/IEMT.2012.6521787
  • Filename
    6521787
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2241072