• DocumentCode
    2241382
  • Title

    Low COO PVD solutions addressing 2.5D and 3D TSV packaging challenges

  • Author

    Auer, Hans ; Hirscher, Hans ; Desjardins, Patrick ; Weichart, Juergen

  • Author_Institution
    OC Oerlikon Balzers Ltd., Isramali 18, FL-9496, Liechtemstein
  • fYear
    2012
  • fDate
    6-8 Nov. 2012
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    As with any emerging technology, 2.5D and 3D IC TSV packaging integration brings new challenges. Amongst others, we will review thin wafer handling, organic passivation outgassing control, glue layers critical thermal management and TSV high aspect ratio barrier and seed layers deposition. We will then demonstrate how Oerlikon´s PVD technology has managed to address each of these issues with manufacturing low COO solutions.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium (IEMT), 2012 35th IEEE/CPMT International
  • Conference_Location
    Ipoh, Perak, Malaysia
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4673-4384-8
  • Electronic_ISBN
    1089-8190
  • Type

    conf

  • DOI
    10.1109/IEMT.2012.6521799
  • Filename
    6521799
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2241382