Title :
Large area mold embedding technology with PCB based redistribution
Author :
Braun, Torsten ; Becker, Karl-Friedrich ; Bottcher, L. ; Ostmann, Andreas ; Jung, Edward ; Voges, S. ; Thomas, Tessamma ; Kahle, R. ; Bader, Volker ; Bauer, J. ; Aschenbrenner, R. ; Schneider Ramelow, M. ; Lang, K.-D.
Author_Institution :
Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer-Allee 25, 13355 Berlin, Germany
Abstract :
The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing and 3D integration with potential for low cost applications. Large area mold embedding technologies and embedding of active components into printed circuit boards (Chip-in-Polymer) are two major packaging trends in this area.
Conference_Titel :
Electronic Manufacturing Technology Symposium (IEMT), 2012 35th IEEE/CPMT International
Conference_Location :
Ipoh, Perak, Malaysia
Print_ISBN :
978-1-4673-4384-8
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2012.6521803
