Optimization of electronic chip-mounting machine using SOM-TSP method with 5 dimensional data

The SOM-TSP (self-organizing map for traveling salesman problems) method can easily handle increased dimensions compared to other TSP methods, such as the Hopfield method, Chaotic method... etc. This offers the possibility of the method being applied to various optimization problems. In this paper, we propose the application of the SOM-TSP method, with 5 dimensional data, in optimizing the efficiency of surface mounting electronic components onto printed circuit boards. The algorithm which, consists of 2 processes, was applied to the problem and a reduction in mounting time was achieved.