DocumentCode :
2242373
Title :
Temperature and refractive index measurements using long-period fiber gratings fabricated by femtosecond laser
Author :
YU, Yongqin ; Zheng, Liarong ; Kai Yi ; Ruan, Shuangchen ; Chenlin Du ; Jianhui Huang ; Wansheng Zhong
Author_Institution :
Shenzhen Key Lab. of Laser Eng., Shenzhen, China
fYear :
2011
fDate :
13-16 Nov. 2011
Firstpage :
1
Lastpage :
7
Abstract :
Long period fiber gratings (LPFGs) with different periods in the standard single mode fiber were fabricated, using laser direct writing method, by femtosecond laser pulses with pulse width of 200 fs and the repetition rate of 250 kHz at a center wavelength of 800 nm in air. Comparative with bare LPFG in temperature sensor, LPFG had been encapsulated using large coefficient of thermal expansion of epoxy polymer and Aluminum to enhance the temperature sensitivity. The results showed that the temperature sensitivity of encapsulated LPFG was 2 times than that of bare LPFG. In addition, we also researched the relationship between resonant wavelength and surrounding refractive index (SRI) when LPFG immersed in refractive index of solution of different index at 20 degree Celsius.
Keywords :
aluminium; diffraction gratings; fibre optic sensors; high-speed optical techniques; laser materials processing; optical fibre fabrication; refractive index measurement; temperature measurement; thermal expansion; coefficient of thermal expansion; epoxy polymer; femtosecond laser; frequency 250 Hz; laser direct writing method; long-period fiber gratings; refractive index measurement; standard single mode fiber; surrounding refractive index; temperature measurement; temperature sensitivity; temperature sensor; time 200 fs; wavelength 800 nm; Abstracts; Coatings; Mirrors; Ovens; Polymers; Slabs; Superluminescent diodes; Femtosecond laser pulse; Surrounding refractive index; long-period fiber gratings; micromachining; temperature sensor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Communications and Photonics Conference and Exhibition, 2011. ACP. Asia
Conference_Location :
Shanghai
ISSN :
2162-108X
Print_ISBN :
978-0-8194-8961-6
Type :
conf
DOI :
10.1117/12.904386
Filename :
6210630
Link To Document :
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