Sub-half micron metallization using high pressure Al

The continuing drive towards smaller feature sizes increases the demand on multi level metallization. Aluminium plug technology has clear advantages over W-Plug. These include lower resistance vias, fewer overall process steps and better electromigration performance. Conventional Al reflow processes have not gained wide acceptance at, or beyond 0.35 /spl mu/m technology due to their sensitivities to surface conditions and hole profile. High pressure Al filling (Forcefill/sup (R)/), developed by Electrotech, is now becoming the preferred technique for the filling of high aspect ratio structures.