Title :
A new passive CMOS telemetry chip to receive power and transmit data for a wide range of sensor applications
Author :
Dudenbostel, Dirk ; Krieger, Karl-Ludwig ; Candler, Claudia ; Laur, Rainer
Author_Institution :
Inst. for Electromagnetic Theory & Microelectron., Bremen Univ., Germany
Abstract :
A new full integrated telemetry chip with the possibility of integrated micro coils on the chip is presented. The telemetry chip receives the power for the sensor microsystem. Using a passive modulation technique the telemetry chip transmits measured data to the external power transmitter. In order to verify the performance of the telemetry chip, the transfer channel between the external transmitter and the receiver with the circuits of the telemetry chip have been simulated with SPICE. Measurements of a produced telemetry chip were made to confirm our technical concept and they verify the full operation of our telemetry chip
Keywords :
CMOS integrated circuits; SPICE; circuit analysis computing; coils; digital simulation; electric sensing devices; telemetry; SPICE simulation; external power transmitter; micro coils; passive CMOS telemetry chip; passive modulation technique; sensor applications; transfer channel; Clocks; Coils; RLC circuits; Radio frequency; Semiconductor device measurement; Telemetry; Temperature sensors; Transmitters; Voltage control; Wireless sensor networks;
Conference_Titel :
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-3829-4
DOI :
10.1109/SENSOR.1997.635305