Title :
Al reflow studies for deep-submicron structures: properties and microstructure
Author :
Webster, M.N. ; Dirks, A.G.
Author_Institution :
Philips Res. Lab., Eindhoven, Netherlands
Abstract :
We have investigated the Al reflow mechanism in deep-submicron contacts and vias. In a "cold/hot" sputter process the Al reflow temperature was varied between 435-500/spl deg/C. It was found that the liner has a strong influence on the Al reflow process.
Keywords :
aluminium; integrated circuit metallisation; sputtered coatings; 435 to 500 C; Al; Al reflow; contact; deep-submicron structure; liner; microstructure; sputter process; via; Artificial intelligence; Electrical resistance measurement; Inorganic materials; Laboratories; Metallization; Microstructure; Rough surfaces; Surface roughness; Temperature; Tin;
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
DOI :
10.1109/MAM.1997.621066
