High pressure aluminium for sub-micron vias using a liquid transducer

Recently, high pressure via-fill has been developed as a new method to manufacture ULSI sub-micron diameter Al contacts with a high aspect ratio. In this paper the fabrication of sub-micron Al vias using silicon oil (polymethylsiloxane) at high pressures is investigated. The high pressure via-fill process is performed on sub-micron diameter contacts patterned in SiO/sub 2/ on Si(100) and covered with a hot-sputtered bridging AlCu(O.5%)Si(1%) film on a Ti/TiN barrier layer. During the process samples are heated to a temperature in the range of 250-400/spl deg/C and pressurized between 60 and 200 MPa using silicon oil as transducer. It is found that in this temperature and pressure range contact-fill is possible.