Title :
Hybrid-integrated coherent receiver using silica-based planar lightwave circuit technology
Author :
Kim, Jong-Hoi ; Choe, Joong-Seon ; Choi, Kwang-Seong ; Youn, Chun-Ju ; Kim, Duk-Jun ; Jang, Sun-Hyok ; Kwon, Yong-Hwan ; Nam, Eun-Soo
Author_Institution :
Electron. & Telecommun. Res. Inst. (ETRI), Daejeon, South Korea
Abstract :
A hybrid-integrated coherent receiver module has been achieved using flip-chip bonding technology, consisting of a silica-based 90°-hybrid planar lightwave circuit (PLC) platform, a spot-size converter integrated waveguide photodiode (SSC-WG-PD), and a dual-channel transimpedance amplifier (TIA). The receiver module shows error-free operation up to 40Gb/s and OSNR sensitivity of 11.5 dB for BER = 10-3 at 25 Gb/s.
Keywords :
error statistics; flip-chip devices; integrated circuit bonding; integrated optoelectronics; operational amplifiers; optical noise; optical receivers; optical waveguides; photodiodes; silicon compounds; BER; OSNR sensitivity; PLC platform; SSC-WG-PD; SiO2; TIA; bit rate 25 Gbit/s; bit rate 40 Gbit/s; dual-channel transimpedance amplifier; error-free operation; flip-chip bonding; hybrid-integrated coherent receiver module; silica-based planar lightwave circuit technology; spot-size converter integrated waveguide photodiode; Abstracts; Bonding; Optical fiber communication; Optical fiber dispersion; Silicon compounds; Coherent receiver; balanced photodiode; coherent detection; coherent optical communications; flip-chip bonding; hybrid integration; optical 90°-hybrid; planar lightwave circuit; quadrature phase shift keying; spot-size converter;
Conference_Titel :
Communications and Photonics Conference and Exhibition, 2011. ACP. Asia
Conference_Location :
Shanghai
Print_ISBN :
978-0-8194-8961-6
