Title :
A modular environment for the design of micromachined silicon devices
Author :
Steffensen, L. ; Than, O. ; Büttgenbach, S.
Author_Institution :
Tech. Univ. Braunschweig, Germany
Abstract :
This paper reports on a modular environment for the design of micromachined silicon devices which is based on a 3D simulation module for silicon anisotropic etching. The simulation data are processed into an adequate volume representation that meets the geometrical requirements of finite element modelling tools. The design environment uses an object-oriented geometric modelling interface serving as the basis of a product model which centrally stores the data of the whole design process. The paper concludes with an example that illustrates the design process
Keywords :
CAD; computational geometry; elemental semiconductors; etching; finite element analysis; micromachining; micromechanical devices; object-oriented programming; programming environments; semiconductor device models; semiconductor process modelling; silicon; tree data structures; 3D simulation module; SUZANA simulation; Si; Si anisotropic etching; design environment; finite element modelling tools; geometrical requirements; micromachined Si device design; modular environment; object-oriented geometric modelling interface; product model; volume representation; Anisotropic magnetoresistance; Design automation; Electronic switching systems; Etching; Finite element methods; Object oriented modeling; Process design; Shape; Silicon devices; Solid modeling;
Conference_Titel :
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-3829-4
DOI :
10.1109/SENSOR.1997.635359
