• DocumentCode
    2244676
  • Title

    A New Thermal-Conscious System-Level Methodology for Energy-Efficient Processor Voltage Selection

  • Author

    Liu, Yongpan ; Wang, Yu ; Zhang, Feng ; Luo, Rong ; Wang, Hui

  • Author_Institution
    Dept. of Electron. Eng., Tsinghua Univ., Beijing
  • fYear
    2006
  • fDate
    4-7 Dec. 2006
  • Firstpage
    968
  • Lastpage
    971
  • Abstract
    In this paper, we propose a thermal-conscious system-level methodology to make energy-efficient voltage selection (VS) for nanometer processors under real-time constraints. New modeling parameters, such as power composition ratio (PCR), thermal resistance, are integrated and considered in our system models, and their impacts on energy consumption are explored. The interdependence between temperature and power is modeled in an iterative way and two nonlinear programming formulations are presented to determine the optimal energy-efficient supply voltages. Our experiment results show that the energy estimation discrepancy given by the thermal-conscious and traditional system models can reach up to 50% in 65nm PTM CMOS technology, which again underscores the necessity of a thermal-aware power model. Furthermore, our thermal-conscious voltage selection (TCVS) approach can achieve up to 12% further energy savings and much lower peak temperature than the traditional approach. Finally, our specific temperature voltage selection (STVS) approach can reduce the computation complexity greatly with acceptable energy overheads compared with TCVS
  • Keywords
    integrated circuit modelling; iterative methods; microprocessor chips; nonlinear programming; 65 nm; PTM CMOS technology; energy consumption; energy estimation discrepancy; energy-efficient processor voltage selection; energy-efficient supply voltages; nanometer processors; nonlinear programming formulations; power composition ratio; thermal resistance; thermal-aware power model; thermal-conscious system-level methodology; CMOS technology; Dynamic voltage scaling; Energy consumption; Energy efficiency; Power system modeling; Semiconductor device modeling; Temperature dependence; Thermal engineering; Thermal resistance; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2006. APCCAS 2006. IEEE Asia Pacific Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    1-4244-0387-1
  • Type

    conf

  • DOI
    10.1109/APCCAS.2006.342223
  • Filename
    4145556