Title : 
Stress-Induced Bending of Micromachined Bilayer Cantilever and Its Optical Application
         
        
            Author : 
Kuo, Ju-Nan ; Lee, Gwo-Bin ; Pan, Wen-Fung
         
        
            Author_Institution : 
Dept. of Eng. Sci., National Cheng Kung Univ., Tainan
         
        
        
        
        
        
            Abstract : 
In this paper, the shape effect of metal films on stress-induced bending of micromachined bilayer cantilever was first systematically investigated. The cantilever makes use of residual stresses in thin films to produce a bending of micro-structures by applying preloads. A finite element analysis (FEA) model was established to analyze such a deformation, with the support of experimental and theoretical results. A new founding on the post-processing temperature of the micromachined structure was reported. The post-processing temperature and residual stresses reveal close relations. While the post-processing temperature ascends, the residual stress of the metal increases, resulting in a bigger out-of-plane deformation of the cantilever. The residual stress rises to a saturated value while the temperature reaches a critical value. Finally, a switchable micromachined corner mirror and a high-speed low-voltage double-switch electrostatically actuated optical crossconnect (OXC) were demonstrated using stress-induced cantilevers
         
        
            Keywords : 
bending; cantilevers; finite element analysis; internal stresses; metallic thin films; micro-optics; micromechanical devices; temperature control; MEMS; deformation; electrostatically actuated optical crossconnect; finite element analysis model; metal films; micromachined bilayer cantilever; micromachined structure; post-processing temperature; residual stresses; stress-induced bending; switchable micromachined corner mirror; thermal effect; thin films; Deformable models; Finite element methods; High speed optical techniques; Mirrors; Optical films; Optical saturation; Residual stresses; Shape; Temperature; Transistors; MEMS; Residual stress; Thermal effect; optical crossconnect (OXC);
         
        
        
        
            Conference_Titel : 
Robotics and Biomimetics, 2004. ROBIO 2004. IEEE International Conference on
         
        
            Conference_Location : 
Shenyang
         
        
            Print_ISBN : 
0-7803-8614-8
         
        
        
            DOI : 
10.1109/ROBIO.2004.1521792